Module: Device Manufacturing

Module Specifications.

Current Academic Year 2024 - 2025

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Date posted: September 2024

Module Title	Device Manufacturing
Module Code	EE508 (ITS) / EEN1069 (Banner)
Faculty	Engineering & Computing	School	Electronic Engineering
Module Co-ordinator	Stephen Daniels
Module Teachers	Jennifer Bruton
NFQ level	9	Credit Rating	7.5
Pre-requisite	Not Available
Co-requisite	Not Available
Compatibles	Not Available
Incompatibles	Not Available

None
Array

Description

Module Motivation: This module will enable the student to develop an understanding of device fabrication as it relates to optical, microelectronic, sensors, and other miniaturised devices. The major enabling manufacturing technologies will be analysed as will process flow, integration, design aspects, and statistical methods in manufacturing .

Learning Outcomes

1. Design and analyse the processes involved in micro/nano systems manufacture
2. Calculate important features and limitations of micro and nano system design
3. Analyse the performance of a tool-set and relate to productivity and yield
4. Design device manufacturing process flows
5. Conduct the required background research related to the module topic and be able to identify opportunities for further technology development
6. Write well structured reports which are written to the correct level of technical detail to suit the intended reader

*Type*	*Hours*	*Description*
Workload	Full-time hours per semester
Lecture	36	Lectures
Independent Study	50	Assignment Research & Delivery
Independent Study	102	Self-directed study of materials and study for the examination.
Total Workload: 188

All module information is indicative and subject to change. For further information,students are advised to refer to the University's Marks and Standards and Programme Specific Regulations at: http://www.dcu.ie/registry/examinations/index.shtml

Indicative Content and Learning Activities

Yield Engineering
Functional and parametric yield estimation, equipment issues

Metrology and Control
Tool control and monitoring, integration with factory information systems, statistical and advanced process control

Miniaturisation
Moore's Law, design rules, design for manufacture, basic VLSI circuits

Manufacturing Technologies
Lithography, Etch and Deposition, Planarisation, Laser Processing

Assessment Breakdown
Continuous Assessment	25%	Examination Weight	75%

Type	Description	% of total	Assessment Date
Course Work Breakdown
Assignment	The student will critically review the state of the art for a particular technology related to device manufacturing and develop a road-map for advancement.	25%	Once per semester

Reassessment Requirement Type
Resit arrangements are explained by the following categories: Resit category 1: A resit is available for both* components of the module. Resit category 2: No resit is available for a 100% continuous assessment module. Resit category 3: No resit is available for the continuous assessment component where there is a continuous assessment and examination element.
* ‘Both’ is used in the context of the module having a Continuous Assessment/Examination split; where the module is 100% continuous assessment, there will also be a resit of the assessment
This module is category 1

Indicative Reading List

Gary S. May, Costas J. Spanos: 0, Fundamentals of semiconductor manufacturing and process control, IEEE ; c2006., [Piscataway], 9780471784067

Other Resources

32888, Website, 0, Module Loop Website, loop.dcu.ie,