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Module Specifications..

Current Academic Year 2023 - 2024

Please note that this information is subject to change.

Module Title Device Manufacturing
Module Code EE508
School School of Electronic Engineering
Module Co-ordinatorSemester 1: Stephen Daniels
Semester 2: Stephen Daniels
Autumn: Stephen Daniels
Module TeachersStephen Daniels
Jennifer Bruton
Paul Ahern
Phillip Christie
NFQ level 9 Credit Rating 7.5
Pre-requisite None
Co-requisite None
Compatibles None
Incompatibles None

Module Motivation: This module will enable the student to develop an understanding of device fabrication as it relates to optical, microelectronic, sensors, and other miniaturised devices. The major enabling manufacturing technologies will be analysed as will process flow, integration, design aspects, and statistical methods in manufacturing .

Learning Outcomes

1. Design and analyse the processes involved in micro/nano systems manufacture
2. Calculate important features and limitations of micro and nano system design
3. Analyse the performance of a tool-set and relate to productivity and yield
4. Design device manufacturing process flows
5. Conduct the required background research related to the module topic and be able to identify opportunities for further technology development
6. Write well structured reports which are written to the correct level of technical detail to suit the intended reader

Workload Full-time hours per semester
Type Hours Description
Independent Study50Assignment Research & Delivery
Independent Study102Self-directed study of materials and study for the examination.
Total Workload: 188

All module information is indicative and subject to change. For further information,students are advised to refer to the University's Marks and Standards and Programme Specific Regulations at: http://www.dcu.ie/registry/examinations/index.shtml

Indicative Content and Learning Activities

Yield Engineering
Functional and parametric yield estimation, equipment issues

Metrology and Control
Tool control and monitoring, integration with factory information systems, statistical and advanced process control

Moore's Law, design rules, design for manufacture, basic VLSI circuits

Manufacturing Technologies
Lithography, Etch and Deposition, Planarisation, Laser Processing

Assessment Breakdown
Continuous Assessment25% Examination Weight75%
Course Work Breakdown
TypeDescription% of totalAssessment Date
AssignmentThe student will critically review the state of the art for a particular technology related to device manufacturing and develop a road-map for advancement.25%Once per semester
Reassessment Requirement Type
Resit arrangements are explained by the following categories;
1 = A resit is available for all components of the module
2 = No resit is available for 100% continuous assessment module
3 = No resit is available for the continuous assessment component
This module is category 1
Indicative Reading List

  • Gary S. May, Costas J. Spanos: 0, Fundamentals of semiconductor manufacturing and process control, IEEE ; c2006., [Piscataway], 9780471784067
Other Resources

32888, Website, 0, Module Loop Website, loop.dcu.ie,
Programme or List of Programmes
ECEIMMasters of Eng in Elec & Comp Eng
ECSAOStudy Abroad (Engineering & Computing)
GCECEGrad Cert. in Electronic & Computer Eng
MECEMEng Electronic & Computer Engineering
MEQMasters Engineering Qualifier Course
SMPECSingle Module Programme (Eng & Comp)

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