Latest Module Specifications
Current Academic Year 2025 - 2026
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Description The purpose of this module is to provide an overview of the importance of plasma technology in the modern world and to give the students an awareness and appreciation of the ways in which applications of plasmas can enable the development of new manufacturing technologies and processes. The module deals in detail with the specific plasma surface interactions which determine the performance of processing technologies and examines the most important surface processing applications used in high technology industries, through a detailed treatment of specific examples. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Learning Outcomes 1. Demonstrate the ability to recognise and explain the economic and environmental importance of modern application. 2. Demonstrate the ability to identify the technical aspects of plasma surface interactions and their impact on product quality. 3. Demonstrate the ability to recognise and critically evaluate the most important examples of plasma applications. 4. Demonstrate the ability to access and critically evaluate scientific literature dealing with plasma applications. 5. Demonstrate the ability to communicate the concepts, methods and ideas studied in this module with their peers via online discussion groups. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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All module information is indicative and subject to change. For further information,students are advised to refer to the University's Marks and Standards and Programme Specific Regulations at: http://www.dcu.ie/registry/examinations/index.shtml |
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Indicative Content and Learning Activities
Indicative Syllabus Basic processes, reactions, simple kinetic models. Plasma Surface Interactions: Surface states and structure. Ion, electron and photon surface interactions. Surface chemical kinetics. Surface Processing: Activation (surface energy, wetability and adhesion). Sputtering (sputter etching, sputter deposition and reactive sputter deposition). Etching (including RIE and high density plasma etching), etching characteristics (anisotropy, residues, selectivity, uniformity, damage). Deposition of thin films, PECVD. Film properties and structure (hardness and other physical properties, amorphous films, plasma polymerisation, epitaxial growth, interface issues). Specific Examples: Detailed examples of plasma processes including the plasma surface interaction mechanisms. Examples may include fluorocarbon etching of silicon and SiO2, CH4+H2 diamond deposition, activation of polymers and plasma processing of natural and artificial fibers, deposition of bio-compatible thin films, deposition of metallic coatings and alloys, and/or others. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Indicative Reading List Books:
Articles: None | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Other Resources None | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||