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Module Title |
Plasma Science and Technology
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Module Code |
PS406
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School |
School of Physical Sciences
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Online Module Resources
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| Module Co-ordinator | Dr Bert Ellingboe | Office Number | N104 |
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Level |
4
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Credit Rating |
0
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Pre-requisite |
None
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Co-requisite |
None
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Module Aims
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Present to students the fundamental principles of partially ionised, chemically reactive plasma discharges and their use in thin-film processing and other industrial applications. Introduce the practical aspects of vacuum technology relevant to plasma applications. The students will also be presented with an overview of the experimental techniques used in research and industry to investigate the electronic chemical and structural properties of atomically clean surfaces. Methods for the production of clean surfaces will be discussed.
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Learning Outcomes
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To give the student a strong foundation in the fundamental physical principles that govern low pressure plasma discharges and their application in surface processing including etching and deposition.
To give the student a detailed understanding of the techniques used to investigate the physical and chemical properties of surfaces.
To provide the student with a broad awareness of the current applications of plasma processing and surface analysis techniques in industry (semiconductor fabrication, catalysis, plasma processing of surfaces, medicine).
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Indicative Time Allowances
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Hours
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Lectures |
24
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Tutorials |
6
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Laboratories |
0
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Seminars |
0
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Independent Learning Time |
45
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Total |
75
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Placements |
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Assignments |
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NOTE
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Assume that a 0 credit module load represents approximately 75 hours' work, which includes all teaching, in-course assignments, laboratory work or other specialised training and an estimated private learning time associated with the module.
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Indicative Syllabus
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Vacuum Technology: Vacuum generation and measurement: pumps, gauges, RGAs. Vacuum system design: gas flow, sealing techniques, material compatibility and cleaning. UHV and the preparation of atomically clean surfaces.
Electromagnetic Interactions in Plasmas: Charged particle dynamics. Debye shielding. Ambipolar diffusion and plasma sheaths. Electron heating mechanisms.
Plasma Chemistry: Collisions and cross sections. Plasma composition. Radiation transport.
Plasma Properties and Generation: Particle and energy balance. Confinement. DC, RF and microwave plasmas.
Plasmas in Industry: Etching, sputtering, deposition. Plasma monitoring and control.
Surface Chemical Structure: Electron energy analysers, X-ray and Electron sources / monochromators, Synchrotron Radiation, UV and X-ray Photoelectron Spectroscopy (PES, XPS), Auger Electron Spectroscopy (AES), Secondary ion mass spectroscopy (SIMS), Quantitative analysis by XPS, AES, SIMS.
Surface Structure: 2-dimensional lattices, reciprocal lattices, Ewald construction. Low Energy Electron Diffraction (LEED), Reflection High Energy Electron Diffraction (RHEED), Scanning Tunnelling Microscopy (STM), X-Ray Diffraction.
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| Assessment | | Continuous Assessment | 30% | Examination Weight | 70% |
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Indicative Reading List
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1.Principles of Plasma Discharges and
Materials Processing Woodruff D.P and Delchar, T.A. (Cambridge Universit Press 1995)
2. Modern Techniques of Surface Science J.C.Vickerman.
3. Surface Analysis: The principle techniques.
Michael A. Lieberman, Allan J. Lichtenberg
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Programme or List of Programmes
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| BSSA | Study Abroad (DCU Business School) |
| BSSAO | Study Abroad (DCU Business School) |
| ECSA | Study Abroad (Engineering & Computing) |
| ECSAO | Study Abroad (Engineering & Computing) |
| HMSA | Study Abroad (Humanities & Soc Science) |
| HMSAO | Study Abroad (Humanities & Soc Science) |
| SHSA | Study Abroad (Science & Health) |
| SHSAO | Study Abroad (Science & Health) |
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