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Academic Structures
Programme Academic Structure for 2024 - 2025, Masters Engineering Qualifier Course
This information is provisional & subject to change.
Explanation of Terms/Frequently Asked Questions
Modular Programme Structure
Year C Optional Modules;
Code
Title
Credit
Semester
Resit Category
EE402
OOP with Embedded Systems
7.5
Semester 1
1
EE417
Web Application Development
7.5
Semester 2
1
EE445
Bioelectronics
7.5
Semester 2
1
EE452
Wireless/Mobile Communications
7.5
Semester 1
1
EE453
Image Processing & Analysis (Plus)
7.5
Semester 1
1
EE454
Optical Communications System Design
7.5
Semester 2
3
EE459
Mechatronic System Simulation & Control
7.5
Semester 2
1
EE463
Solid State Electr. & Semiconductor Devices
7.5
Semester 1
1
EE470
Introduction in Engineering Management
7.5
Semester 2
1
EE488
Mathematical Techniques and Problem Solving
7.5
Semester 1
1
EE497
3D Interface Technologies
7.5
Semester 2
1
EE500
Network Performance
7.5
Semester 1
1
EE5001
Security for IoT and Edge Networks
7.5
Semester 2
1
EE506
Photonic Devices
7.5
Semester 1
3
EE507
Entrepreneurship for Engineers
7.5
Semester 2
1
EE508
Device Manufacturing
7.5
Semester 2
1
EE513
Connected Embedded Systems
7.5
Semester 2
1
EE514
Data Analysis and Machine Learning
7.5
Semester 1
1
EE515
Real-Time Digital Signal Processing (DSP)
7.5
Semester 1
1
EE516I
Blockchain Scalability
7.5
Semester 1
1
EE517
Network Analysis and Dimensioning
7.5
Semester 2
1
EE518
Photonic Applications and Technologies
7.5
Semester 2
1
EE521
Future Network Architectures
7.5
Semester 2
1
EE535
Energy System Decarbonisation
7.5
Semester 1
1
EE544
Computer Vision
7.5
Semester 2
1
EE559
Nanoelectronics Technology
7.5
Semester 1
1
EE562
Network Stack Implementation
7.5
Semester 2
1
PS508A
Fundamentals of Industrial Plasmas
7.5
Semester 1
3
PS510A
Plasma Applications
7.5
Semester 2
3
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